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铜箔镀金 铜箔镀锡 PI镀锡 镀铜 PET镀银合金如何正确使用在各行业

Time:2021-12-14Number:741

XJYYB-25系列镀金铜箔,基材为软态压延铜箔(>99.9%纯铜),基材具有良好的导电性,镀金表面电接触性能   优良且具备 的抗电化学腐蚀性,易钎焊。

根据客户需求,我司同时可以生产镀锡,镀银等其他金属镀层满足特殊应用,铜箔厚度10-100微米,幅宽    达到540mm.

XJYYB-25Series gold plated copper foil, base material is Rolled temper pure copper foil (>99.9% Copper), The foil not only function excellent electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process.



幅宽Width

520±10mm

卷尺测量Tape measurement

卷长Length

200m/Roll

卷尺测量Tape measurement

颜色Color

金色Gold Yellow

目测Visual

总厚度Total Thickness

26µm±10%

ASTM D1000

铜箔厚Copper Foil Thickness

25µm±10%

ASTM D1000

镀金层厚度Gold Coating

0.04µm±0.01

ASTM D1000

镀层结合力Cotaing Bonding Str

5B

内部标准Inside Standard

方阻Surface Resistance

≤0.02 Ω/ㅁ

Test by MIL-G-83528

盐雾测试Salt spray test

24Hrs

ASTM B117-2003

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