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 Halogen free anisotropic conductive adhesive(Conductive Adhesive)
Low temperature hot pressing/high peel strength
Advanced Institute of Technology's anisotropic conductive adhesive research platinum S series is aModified resin anisotropic conductive adhesiveColloidal transparent, halogen-free, meets ROHS and REACH environmental requirements, requires low-temperature storage (around 0 ℃), can be used for FOG connection between touch screen and FPC, and pin corner connection of keyboard circuit.
Purpose: FOG connection, fast up and down conduction connection for thin lines.
Specialty: Smooth printing, non stick and non dry mesh; The hot pressing temperature is relatively low; High adhesive strength; Halogen free (compliant with REACH standards); Colloidal transparency makes it easy to align.
Pre curing characteristics
| Items | Data | Remark | 
| project | Measurement value | Preparing for exams | 
| Appearance | yello | |
| appearance | yellow | |
| Viscosity | 50-60Pa·s | Brookfield 52Z ,5rpm | 
| viscosity | ||
| Specific gravity | 1.07 | Cup | 
| proportion | Specific gravity cup GB/T 13354-1992 | |
| Cure time | 10-15seconds | 140 ℃ -160 ℃ pressure 3Mpa | 
| Curing time | ||
| Storage | 3months | -Below 5 ℃ | 
| Storage conditions | 7days | 25℃ | 
Characteristics after curing
| Items | Data | Remark | 
| project | Measurement value | Preparing for exams | 
| Pencil hardness | HB-4B | |
| Hardness (pencil hardness) | ||
| Peel strength | 32MPa | Glass/FPC | 
| peel strength | 10mm/min | |
| Peel strength | 91N/25mm | PET/FPC | 
| peel strength | 50mm/min | |
| Volume resistivity | ||
| Volume resistance | 
  
 
  
 
 
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