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Conductive silver adhesiveTS-0253TID-120 is a modified epoxy conductive adhesive that does not contain solvents and requires low-temperature storage (around 0 ℃). It can be used for large-area pressing of metals and target materials. The dispensing process is smooth and can also be operated using screen printing. Good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, certain flexibility, and excellent conductivity. 130 ℃ * 15 minutes
Purpose: Fingerprint recognition module.
Specialty: Smooth dispensing, smooth silk screen printing, excellent conductivity, high adhesive strength.
Pre curing characteristics
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Appearance |
Silver |
|
| appearance |
silver gray |
|
| Viscosity |
10-15Pa·s |
Brookfield 52Z ,5rpm |
| viscosity |
||
| Specific gravity |
3.13 |
Cup |
| proportion |
Specific gravity cup GB/T 13354-1992 |
|
| Cure time |
50-60minutes |
120℃ |
| Curing time |
||
| Storage |
3months |
-5℃-5℃ |
| Storage conditions |
1days |
25℃-30℃ |
Characteristics after curing
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Pencil hardness |
3H-6H |
|
| Hardness (pencil hardness) |
||
| Lap shear strength |
22MPa |
Glass/nickel plated copper sheet |
| shear strength |
10mm/min |
|
| Peel strength |
71N/25mm |
Glass/nickel plated copper sheet |
| peel strength |
50mm/min |
|
| Volume resistivity |
0.0003ΩNaN(410TS) 0.0003ΩNaN(450TS) |
130℃*15min |
| Volume resistance |
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