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Low temperature curing conductive silver adhesive
Conductive Adhesive
Low to medium temperature curing/high adhesive strength/reflow resistance
Conductive silver adhesive research platinum 6001 is a productModified epoxy conductive adhesiveIt requires low-temperature storage (around 0 ℃) and can be used as a substitute for low-temperature welding and bonding. Smooth dispensing, good shape retention (no deformation, collapse, or diffusion of adhesive points), high bonding strength, good flexibility, and excellent conductivity.
Purpose: To replace low-temperature soldering.
Specialty: Smooth dispensing, excellent conductivity, very high bonding strength, and excellent drop resistance.
Low temperature curing: 20 minutes at 100 degrees Celsius
Pre curing characteristics
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Appearance |
Silver |
|
| appearance |
silver gray |
|
| Viscosity |
10-15Pa·s |
Brookfield 52Z ,5rpm |
| viscosity |
||
| Specific gravity |
2.5 |
Cup |
| proportion |
Specific gravity cup GB/T 13354-1992 |
|
| UV Cure time |
10-20minutes |
100℃-120℃ |
| Curing time |
||
| Storage |
3months |
-5℃-5℃ |
| Storage conditions |
7days |
25℃ |
Characteristics after curing
| Items |
Data |
Remark |
| project |
Measurement value |
Preparing for exams |
| Pencil hardness |
2H-6H |
|
| Hardness (pencil hardness) |
||
| Lap shear strength |
30MPa |
Glass/nickel plated copper sheet |
| shear strength |
10mm/min |
|
| Peel strength |
91N/25mm |
Glass/nickel plated copper sheet |
| peel strength |
50mm/min |
|
| Volume resistivity |
0.0001ΩNaN(410TS) 0.0001ΩNaN(450TS) |
120℃*10min |
| Volume resistance |
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